XC238X Просмотр технического описания (PDF) - Infineon Technologies

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производитель

XC238X

16/32-Bit Single-Chip Microcontroller with 32-Bit Performance

Infineon Technologies 

XC2387

XC2000 Family Derivatives

Preliminary

Package and Reliability

5

Package and Reliability

In addition to the electrical parameters, the following information ensures proper

integration of the XC238x into the target system.

5.1

Packaging

These parameters describe the housing rather than the silicon.

Table 26 Package Parameters (PG-LQFP-144)

Parameter

Symbol

Limit Values Unit Notes

Min.

Max.

Exposed Pad Dimension Ex × Ey –

6.5 × 6.5 mm –

Power Dissipation

Thermal resistance

Junction-Ambient

PDISS

–

RΘJA

–

1.0

W

–

45

K/W No thermal via1)

36

K/W 4-layer, no pad2)

22

K/W 4-layer, pad3)

1) Device mounted on a 2-layer or 4-layer board without thermal vias.

2) Device mounted on a 4-layer board with thermal vias, exposed pad not soldered.

3) Device mounted on a 4-layer board with thermal vias, exposed pad soldered to the board.

Data Sheet

101

V0.1, 2007-06

Draft Version

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