SA58637BS,118 Просмотр технического описания (PDF) - NXP Semiconductors.
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SA58637BS,118 Datasheet PDF : 22 Pages
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NXP Semiconductors
SA58637
2 × 2.2 W BTL audio amplifier
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Abbreviations
Table 11. Abbreviations
Acronym
Description
BTL
Bridge-Tied Load
CMOS
Complementary Metal Oxide Semiconductor
DAP
Die Attach Paddle
ESD
ElectroStatic Discharge
HF
High-Frequency
NPN
Negative-Positive-Negative
PCB
Printed-Circuit Board
PNP
Positive-Negative-Positive
RMS
Root Mean Squared
SE
Single-Ended
THD
Total Harmonic Distortion
18. Revision history
Table 12. Revision history
Document ID
Release date
SA58637_1
20080225
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
SA58637_1
Product data sheet
Rev. 01 — 25 February 2008
© NXP B.V. 2008. All rights reserved.
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