ESD9B Просмотр технического описания (PDF) - ON Semiconductor

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ESD9B

Transient Voltage Suppressors

ON Semiconductor 

ESD9B, SZESD9B

Transient Voltage

Suppressors

Micro−Packaged Diodes for ESD Protection

The ESD9B Series is designed to protect voltage sensitive

components from ESD. Excellent clamping capability, low leakage,

and fast response time provide best in class protection on designs that

are exposed to ESD. Because of its small size, it is suited for use in

cellular phones, MP3 players, digital cameras and many other portable

applications where board space comes at a premium.

http://onsemi.com

Specification Features

• Low Capacitance 15 pF

• Low Clamping Voltage

• Small Body Outline Dimensions: 0.039″ x 0.024″ (1.0mm x 0.60mm)

• Low Body Height: 0.016″ (0.4 mm)

• Stand−off Voltage: 3.3 V, 5 V

• Low Leakage

• Response Time is < 1 ns

• IEC61000−4−2 Level 4 ESD Protection

• AEC−Q101 Qualified and PPAP Capable

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements

• This is a Pb−Free Device

Mechanical Characteristics

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

IEC 61000−4−2 (ESD)

Contact

Air

±18

kV

±18

IEC 61000−4−4 (EFT)

40

A

Total Power Dissipation on FR−5 Board

(Note 1) @ TA = 25°C

Thermal Resistance, Junction−to−Ambient

Junction and Storage Temperature Range

Lead Solder Temperature − Maximum

(10 Second Duration)

°PD°

RqJA

TJ, Tstg

TL

300

mW

400

°C/W

−55 to +150 °C

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

SOD−923

CASE 514AB

MARKING DIAGRAM

XM

X = Specific Device Code

M Date Code

ORDERING INFORMATION

Device

Package

Shipping†

ESD9B3.3ST5G

SOD−923 8000/Tape & Reel

(Pb−Free)

ESD9B5.0ST5G

SOD−923 8000/Tape & Reel

(Pb−Free)

SZESD9B5.0ST5G SOD−923 8000/Tape & Reel

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

© Semiconductor Components Industries, LLC, 2011

1

December, 2011 − Rev. 2

Publication Order Number:

ESD9B/D

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