RF5110GPCBA-410 Просмотр технического описания (PDF) - RF Micro Devices

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Компоненты Описание

производитель

RF5110GPCBA-410

3V GSM POWER AMPLIFIER

RF Micro Devices 

RF5110G

PCB Design Requirements

PCB Surface Finish

The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch

to 8μinch gold over 180μinch nickel.

PCB Land Pattern Recommendation

PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested

for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-

cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.

PCB Metal Land Pattern

A = 0.64 x 0.28 (mm) Typ.

B = 0.28 x 0.64 (mm) Typ.

C = 1.50 (mm) Sq.

Dimensions in

mm.

1.50 Typ.

0.50 Typ.

Pin 16

Pin 1

A

0.50 Typ.

A

A

BBBB

C

Pin 12

A

A

0.75 Typ.

1.50

A

Typ.

A

0.55 Typ.

0.55 Typ.

A

BBBB

Pin 8

0.75 Typ.

Figure 1. PCB Metal Land Pattern (Top View)

Rev A4 DS071026

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

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