RF3146DPCBA-41X Просмотр технического описания (PDF) - RF Micro Devices

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RF3146DPCBA-41X

DUAL-BAND GSM900/DCS POWER AMP MODULE

RF Micro Devices 

RF3146D

PCB Design Requirements

PCB Surface Finish

The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is

3μinch to 8μinch gold over 180μinch nickel.

PCB Land Pattern Recommendation

PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and

tested for optimized assembly at RFMD; however, it may require some modifications to address company specific

assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.

PCB Metal Land Pattern

A = 0.64 x 0.28 (mm) Typ.

B = 0.28 x 0.64 (mm) Typ.

C = 5.65 (mm) Sq.

5.50 Typ.

Dimensions in mm.

0.50 Typ.

Pin 48

BBBBBBBBBBBB

Pin 1

A

0.50 Typ.

A

Pin 36

A

A

A

A

A

A

2.75

A

A

A

A

C

A

5.50 Typ.

A

A

A

A

A

A

A

A

A

0.55 Typ.

A

A

BBBBBBBBBBBB

Pin 24

0.55 Typ.

2.75

Figure 1. PCB Metal Land Pattern (Top View)

2-504

Rev A11 060719

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