PQ030EZ01ZZ_ Просмотр технического описания (PDF) - Sharp Electronics
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PQ030EZ01ZZ_ Datasheet PDF : 19 Pages
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SHARP CORPORATION
(2) Dip soldering
We recommend that solder dip should be 260F or less (Solder temp.) within 10s
and 1 time only. Please obey the note items below concerning solder reflow.
(a) Atter solder dip, please do cooling naturally.
(b) Please shall not give the mechanical stress or the impact stress to the device.
In advance, please confirm fully the dip soldering conditions etc. in the actual application
in order to avoid any soldering bridge.
(3) Hand soldering
This device is basically designed for the soldering such as reflow soldering or dip soldering.
In case when hand soldering is reluctantly needed for m-cation
etc.,
it is recommended that only one hand soldering should be done at 26O’c or less
of soldering iron edge temperature, for 10s or less. Please be careful not to touch
soldering iron edge to leads directly etc. in order not to give any stress to the leads.
Even within the above conditfons regarding solder reflow, solder dip or hand soldering
there is the possibility that the stress given to the terminals by the deformation of PCB makes
the wire in the device package cut. In advance, please con&m fully at the actual application.
7.5 For cleaning
(1) Solvent cleaning : Solvent temperature 45C or less
Immersion for 3 mm or less
(2) Ultrasonic
cleaning
: The effect to device byL ultrasonic cleaning differs
by cleaning bath size, ultrasonic power
output, cleaning time. PCB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn‘t occur any defect before starting
the ultrasonic cleaning.
(3) Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropy.l alcohol
In case when the other solvent is used, there are cases’&
ip
the packaging resin is eroded. Please use the other solvent
.
after thorough con&nation is performed in actual using condition.
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