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PCA9513AD Просмотр технического описания (PDF) - NXP Semiconductors.

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PCA9513AD
NXP
NXP Semiconductors. NXP
PCA9513AD Datasheet PDF : 26 Pages
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NXP Semiconductors
PCA9513A; PCA9514A
Hot swappable I2C-bus and SMBus bus buffer
8.9 Hot swapping and capacitance buffering application
Figure 8 through Figure 11 illustrate the usage of the PCA9513A and PCA9514A in
applications that take advantage of both its hot swapping and capacitance buffering
features. In all of these applications, note that if the I/O cards were plugged directly into
the backplane, all of the backplane and card capacitances would add directly together,
making rise and fall time requirements difficult to meet. Placing a bus buffer on the edge of
each card, however, isolates the card capacitance from the backplane. For a given I/O
card, the PCA9513A and PCA9514A drive the capacitance of everything on the card, and
the backplane must drive only the capacitance of the bus buffer, which is less than 10 pF,
the connector, trace, and all additional cards on the backplane.
See Application Note AN10160, ‘Hot Swap Bus Buffer’ for more information on
applications and technical assistance.
BACKPLANE
BACKPLANE
CONNECTOR
VCC
R1
10 k
R2
10 k
BD_SEL
SDA
SCL
POWER SUPPLY
HOT SWAP
I/O PERIPHERAL CARD 1
R3
10 k
C1
0.01 µF
R4
10 k
R5
10 k
R6
10 k
ENABLE VCC SDAOUT
SDAIN
SCLOUT
SCLIN
READY
GND
CARD1_SDA
CARD1_SCL
POWER SUPPLY
HOT SWAP
I/O PERIPHERAL CARD 2
R7
10 k
C3
0.01 µF
R8
10 k
R9
10 k
R10
10 k
ENABLE VCC SDAOUT
SDAIN
SCLOUT
SCLIN
READY
GND
CARD2_SDA
CARD2_SCL
POWER SUPPLY
HOT SWAP
I/O PERIPHERAL CARD N
R11
10 k
C5
0.01 µF
R12
10 k
R13
10 k
R14
10 k
ENABLE VCC SDAOUT
SDAIN
SCLOUT
SCLIN GND READY
CARDN_SDA
CARDN_SCL
002aab584
Fig 8.
Remark: The PCA9514A can be used in any combination depending on the number of rise time accelerators that are needed
by the system. Normally only one PCA9514A would be required per bus.
Hot swapping multiple I/O cards into a backplane using the PCA9514A in a cPCI, VME, and AdvancedTCA
system
PCA9513A_PCA9514A_4
Product data sheet
Rev. 04 — 18 August 2009
© NXP B.V. 2009. All rights reserved.
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