PCA9512B(2011) Просмотр технического описания (PDF) - NXP Semiconductors.
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PCA9512B Datasheet PDF : 24 Pages
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NXP Semiconductors
PCA9512A; PCA9512B
Level shifting hot swappable I2C-bus and SMBus bus buffer
19. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Feature selection . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
7.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Functional description . . . . . . . . . . . . . . . . . . . 4
8.1
Start-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
8.2
Connect circuitry . . . . . . . . . . . . . . . . . . . . . . . . 5
8.3
Maximum number of devices in series . . . . . . . 5
8.4
Propagation delays . . . . . . . . . . . . . . . . . . . . . . 6
8.5
Rise time accelerators . . . . . . . . . . . . . . . . . . . 7
8.6
ACC boost current enable . . . . . . . . . . . . . . . . 7
8.7
Resistor pull-up value selection . . . . . . . . . . . . 7
8.8
Hot swapping and capacitance buffering
application . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
9
Application design-in information . . . . . . . . . 11
10
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
11.1
Typical performance characteristics . . . . . . . . 14
12
Test information . . . . . . . . . . . . . . . . . . . . . . . . 15
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
14
Soldering of SMD packages . . . . . . . . . . . . . . 18
14.1
Introduction to soldering . . . . . . . . . . . . . . . . . 18
14.2
Wave and reflow soldering . . . . . . . . . . . . . . . 18
14.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 18
14.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19
15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 20
16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
17.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22
17.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
17.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
17.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
18
Contact information. . . . . . . . . . . . . . . . . . . . . 23
19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 January 2011
Document identifier: PCA9512A_PCA9512B
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