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PCA9512ADP(2009) Просмотр технического описания (PDF) - NXP Semiconductors.

Номер в каталоге
Компоненты Описание
производитель
PCA9512ADP
(Rev.:2009)
NXP
NXP Semiconductors. NXP
PCA9512ADP Datasheet PDF : 23 Pages
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NXP Semiconductors
PCA9512A
Level shifting hot swappable I2C-bus and SMBus bus buffer
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
Table 8. Abbreviations
Acronym
Description
AdvancedTCA Advanced Telecommunications Computing Architecture
CDM
Charged-Device Model
cPCI
compact Peripheral Component Interface
ESD
Electrostatic Discharge
HBM
Human Body Model
I2C-bus
Inter-Integrated Circuit bus
MM
Machine Model
PCI
Peripheral Component Interface
PICMG
PCI Industrial Computer Manufacturers Group
SMBus
System Management Bus
VME
VERSAModule Eurocard
PCA9512A_4
Product data sheet
Rev. 04 — 19 August 2009
© NXP B.V. 2009. All rights reserved.
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