DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

UPD3788D Просмотр технического описания (PDF) - NEC => Renesas Technology

Номер в каталоге
Компоненты Описание
производитель
UPD3788D
NEC
NEC => Renesas Technology NEC
UPD3788D Datasheet PDF : 24 Pages
First Prev 21 22 23 24
µPD3788
NOTES ON THE USE OF THE PACKAGE
The application of an excessive load to the package may cause the package to warp or break, or cause chips to
come off internally. Particular care should be taken when mounting the package on the circuit board.
When mounting the package, use a circuit board which will not subject the package to bending stress, or use a
socket.
For this product, the reference value for the three-point bending strengthNote is 300 [N]. Avoid imposing a load,
however, on the inside portion as viewed from the face on which the window (glass) is bonded to the package body
(ceramic).
Note Three-point bending strength test
Distance between supports: 70 mm, Support R: R 2 mm, Loading rate: 0.5 mm / min.
Load
Load
70 mm
70 mm
22
Data Sheet S14664EJ1V0DS00

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]