OM4068 Просмотр технического описания (PDF) - Philips Electronics
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OM4068 Datasheet PDF : 28 Pages
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Philips Semiconductors
LCD driver for low multiplex rates
Product specification
OM4068
Table 5 Bonding pad locations (dimensions in µm).
All x/y coordinates are referenced to bottom left
corner of chip (see Fig.12).
SYMBOL
VDD
VSS
M0
M1
SDIN
SCLK
SCE
SDOUT
BP1
BP2
BP3
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
PAD
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
x
43.100
42.900
43.100
43.100
43.100
43.100
310.450
447.350
604.800
714.850
824.850
924.850
1 024.850
1 124.850
1 224.850
1 327.250
1 432.450
1 532.650
1 783.600
1 783.600
1 783.600
1 783.600
1 783.600
1 783.600
1 783.600
1 783.600
1 783.600
1 783.600
1 783.600
1 514.600
1 370.550
1 270.500
1 170.500
1 070.500
970.550
870.550
770.550
660.550
y
970.500
791.850
661.750
531.750
401.750
271.750
43.100
43.100
43.100
43.100
43.100
43.100
43.100
43.100
43.100
43.100
43.100
43.100
293.850
458.850
603.850
703.850
803.850
903.850
1 003.850
1 103.850
1 203.850
1 323.850
1 453.850
1 711.100
1 711.100
1 711.100
1 711.100
1 711.100
1 711.100
1 711.100
1 711.100
1 711.100
SYMBOL
PAD
SEG28
43
SEG29
44
SEG30
1
SEG31
2
SEG32
3
VLCD
4
Alignment marks
C1
−
C2
−
F
−
x
550.550
430.550
300.550
43.100
43.100
43.100
1769.6
1770.1
172.0
y
1 711.100
1 711.100
1 711.100
1 460.050
1 274.950
1 158.700
1696.9
58.4
1705.2
1998 Jun 18
21
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