NLSX3013 Просмотр технического описания (PDF) - ON Semiconductor
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NLSX3013 Datasheet PDF : 10 Pages
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NLSX3013
MAXIMUM RATINGS
Symbol
Parameter
Condition
Value
Unit
VCC
VCC Supply Voltage
−0.5 to +5.5
V
VL
VL Supply Voltage
−0.5 to +5.5
V
I/O VCC
VCC−Referenced DC Input/Output Voltage
−0.5 to (VCC + 0.3)
V
I/O VL
VL−Referenced DC Input/Output Voltage
−0.5 to (VL + 0.3)
V
VEN
Enable Control Pin DC Input Voltage
−0.5 to +5.5
V
IIK
Input Diode Clamp Current
VI < GND
−50
mA
IOK
Output Diode Clamp Current
VO < GND
−50
mA
ICC
DC Supply Current Through VCC
$100
mA
IL
DC Supply Current Through VL
$100
mA
IGND
DC Ground Current Through Ground Pin
$100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
qJA
Junction−to−Ambient Thermal Resistance (Note 1)
53
°C/W
YJC(top)
Junction−to−Case (Top) Thermal Resistance
<10
°C/W
TJ
Junction Temperature
+125
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured per JESD51−7, with minimum pad spacing on FR−4 board, using 200 mm2 copper area, two 80 mm x 80 mm ground planes and
2.0 ounce copper traces with no air flow.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
VCC Supply Voltage
1.3
4.5
V
VL
VL Supply Voltage
0.9
VCC − 0.4
V
VEN
Enable Control Pin Voltage
GND
4.5
V
VIO
Bus Input/Output Voltage
I/O VCC
I/O VL
GND
GND
4.5
V
4.5
TA
Operating Temperature Range
−40
+85
°C
DI/DV
Input Transition Rise or Rate
VI, VIO from 30% to 70% of VCC; VCC = 3.3 V $ 0.3 V
0
10
ns
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the
Recommended Operating Ranges limits may affect device reliability.
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