NLSX3012 Просмотр технического описания (PDF) - ON Semiconductor
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NLSX3012 Datasheet PDF : 12 Pages
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NLSX3012
PACKAGE DIMENSIONS
UDFN8 1.8 x 1.2, 0.4P
CASE 517AJ−01
ISSUE O
D
AB
0.10 C
PIN ONE
REFERENCE
ÏÏÏÏ
E
0.10 C
TOP VIEW
L1
DETAIL A
NOTE 5
0.05 C
(A3)
0.05 C
A1
SIDE VIEW
A
C
SEATING
PLANE
e/2
(b2)
1
e
DETAIL A
8X L
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
b2 0.30 REF
D 1.80 BSC
E 1.20 BSC
e 0.40 BSC
L 0.45 0.55
L1 0.00 0.03
L2 0.40 REF
(L2)
8
5
BOTTOM VIEW
8X b
0.10 M
0.05 M
CAB
C NOTE 3
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
7X
0.22
8X
0.66
1.50
1
0.32
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
10
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