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NLSX3012DR2G(2009) Просмотр технического описания (PDF) - ON Semiconductor

Номер в каталоге
Компоненты Описание
производитель
NLSX3012DR2G
(Rev.:2009)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
NLSX3012DR2G Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NLSX3012
PACKAGE DIMENSIONS
UDFN8 1.8 x 1.2, 0.4P
CASE 517AJ01
ISSUE O
D
0.10 C
PIN ONE
REFERENCE
ÏÏ
0.10 C
TOP VIEW
AB
E
L1
DETAIL A
NOTE 5
0.05 C
(A3)
0.05 C
A1
SIDE VIEW
A
C
SEATING
PLANE
e/2
(b2)
1
e
DETAIL A
8X L
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
b2 0.30 REF
D 1.80 BSC
E 1.20 BSC
e 0.40 BSC
L 0.45 0.55
L1 0.00 0.03
L2 0.40 REF
(L2)
8
5
BOTTOM VIEW
8X b
0.10 M
0.05 M
CAB
C NOTE 3
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
7X
0.22
8X
0.66
1
0.32
1.50
0.40 PITCH
DIMENSIONS: MILLIMETERS
http://onsemi.com
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