NCP4680
VIN
VOUT VIN
VOUT
Vref
Vref
Current Limit
CE
CE
GND
Current Limit
GND
NCP4680Hxxxx
NCP4680Dxxxx
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
XDFN4*
Pin No.
SC−70
Pin No.
SOT23
Pin Name
Description
1
4
5
VOUT
Output pin
2
3
2
GND
Ground
3
1
3
CE
Chip enable pin (Active “H”)
4
5
1
VIN
Input pin
−
2
4
NC
No connection
*Tab is GND level. (They are connected to the reverse side of this IC.
The tab is better to be connected to the GND, but leaving it open is also acceptable.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (Note 1)
Output Voltage
Chip Enable Input
Output Current
Power Dissipation XDFN0808
VIN
VOUT
VCE
IOUT
6.0
V
−0.3 to VIN + 0.3
V
6.0
V
180
mA
286
mW
Power Dissipation SC−70
Power Dissipation SOT23
PD
380
420
Junction Temperature
TJ
−40 to 150
°C
Storage Temperature
TSTG
−55 to 125
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latch−up Current Maximum Rating tested per JEDEC standard: JESD78.
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