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NCP4623 Просмотр технического описания (PDF) - ON Semiconductor

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Компоненты Описание
производитель
NCP4623 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
NCP4623
PACKAGE DIMENSIONS
D
E
H
1
TOP VIEW
A
c
C
SIDE VIEW
e
e
b1
b L2
L
1
2
3
SOT−89, 5 LEAD
CASE 528AB
ISSUE O
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS INCLUDES LEAD FINISH.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5. DIMENSIONS L, L2, L3, L4, L5, AND H ARE MEAS-
URED AT DATUM PLANE C.
MILLIMETERS
DIM MIN MAX
A 1.40 1.60
b 0.32 0.52
b1 0.37 0.57
c 0.30 0.50
D 4.40 4.60
D2 1.40 1.80
E 2.40 2.60
e 1.40 1.60
H 4.25 4.45
L 1.10 1.50
L2 0.80 1.20
L3 0.95 1.35
L4 0.65 1.05
L5 0.20 0.60
RECOMMENDED
MOUNTING FOOTPRINT*
4X 0.57
1.75
L5
5
4
L3
L4
D2
BOTTOM VIEW
0.45
2.79
1.50
4.65
1.30
1
1.65
2X 1.50
2X
0.62
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
19

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