NCP4623 Просмотр технического описания (PDF) - ON Semiconductor
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NCP4623 Datasheet PDF : 20 Pages
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NCP4623
PACKAGE DIMENSIONS
XDFN6 1.6x1.6, 0.5P
CASE 711AC
ISSUE O
D
2X
0.05 C
PIN ONE
ÉÉÉÉÉÉ REFERENCE
2X
0.05 C
TOP VIEW
0.05 C
A
B
E
A
A1
0.05 C
NOTE 3
SIDE VIEW
C
SEATING
PLANE
D2
1
3
0.05 M C A B
L
2X L1
3X E3
6
e
E2
0.05 M C A B
4
6X b
0.05 M C A B
BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A −−− 0.40
A1 0.00 0.05
b 0.15 0.25
D 1.60 BSC
D2 1.25 1.35
E 1.60 BSC
E2 0.65 0.75
E3 0.15 REF
e 0.50 BSC
L 0.15 0.25
L1 0.05 BSC
RECOMMENDED
MOUNTING FOOTPRINT*
1.70
6X
0.38
PACKAGE
OUTLINE
1
0.77 1.79
0.50
PITCH
6X
0.36
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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