NCP1271(2006) Просмотр технического описания (PDF) - ON Semiconductor

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NCP1271
(Rev.:2006)

Soft−Skip Mode Standby PWM Controller with Adjustable Skip Level and External Latch

ON Semiconductor 

NCP1271

AC

Input

EMI

Filter

*Optional

latch input*

Rskip

skip/latch HV

FB

CS

Vcc

Gnd Drv

NCP1271

Rr*amp

+

Output

Voltage

−

Figure 1. Typical Application Circuit

MAXIMUM RATINGS (Notes 1 and 2)

Rating

Symbol

Value

Unit

VCC Pin (Pin 6)

Maximum Voltage Range

Maximum Current

Skip/Latch, FB, CS Pin (Pins 1−3)

Maximum Voltage Range

Maximum Current

Vmax

Imax

Vmax

Imax

−0.3 to +20

V

100

mA

−0.3 to +10

V

100

mA

Drv Pin (Pin 5)

Maximum Voltage Range

Maximum Current

Vmax

Imax

−0.3 to +20

V

−800 to +500

mA

HV Pin (Pin 8)

Maximum Voltage Range

Maximum Current

Power Dissipation and Thermal Characteristics

Thermal Resistance, Junction−to−Air, SO−7, Low Conductivity PCB (Note 3)

Thermal Resistance, Junction−to−Lead, SO−7, Low Conductivity PCB

Thermal Resistance, Junction−to−Air, SO−7, High Conductivity PCB (Note 4)

Thermal Resistance, Junction−to−Lead, SO−7, High Conductivity PCB

Vmax

Imax

RqJA

RqJL

RqJA

RqJL

−0.3 to +500

100

177

75

136

69

V

mA

°C/W

°C/W

°C/W

°C/W

Operating Junction Temperature Range

Maximum Storage Temperature Range

TJ

−40 to +125

°C

Tstg

−60 to +125

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device contains ESD protection and exceeds the following tests:

Pins 1−6: Human Body Model 2000 V per Mil−Std−883, Method 3015

Machine Model Method 150 V (on Pins 5 and 6) and 200 V (all other pins)

Pin 8 is the HV startup of the device and is rated to the maximum rating of the part, or 500 V

This device contains latchup protection and exceeds 100 mA per JEDEC Standard JESD78.

2. Guaranteed by design, not tested.

3. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 80 mm2 of 2 oz copper traces and heat spreading area. As specified for

a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow.

4. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified

for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow.

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