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NCP1207A Просмотр технического описания (PDF) - ON Semiconductor

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NCP1207A Datasheet PDF : 17 Pages
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NCP1207A, NCP1207B
HV
7.0
mA
VCC
PON
+-
+
12 V, 10 V,
5.3 V (fault)
VUVLO
4.5/1.5ms
Delay
+
-
+
OVP
Demag
+
5.0 V
/1.44
-+
8/4.5ms
Blanking
SQ
S*
R* R Q
-
+
+
50 mV
Resd
Rint
10 V
Driver: src = 20
VCC sink = 10
Demag
Drv
4.2 V
GND
To Internal
Supply
Fault
Mngt.
Overload?
Soft-Start = 1 ms
+
/3
FB
-
1.0 V 200 mA
when Drv
is OFF
*S and R are level triggered whereas S is edge
triggered. R has priority over the other inputs.
5.0 ms
Timeout
Timeout
Reset
380 ns
L.E.B.
CS
Demag
MAXIMUM RATINGS
Figure 2. Internal Circuit Architecture
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Rating
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Power Supply Voltage, VCC Pin, Continuous Voltage
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Transient Power Supply Voltage, Duration < 10 ms, IVCC < 20 mA
Symbol
VCC Static
VCC Pulse
Value
20
25
Units
V
V
Maximum Voltage on Pin 5 (Drv)
-
20
V
Maximum Voltage on all other pins except Pin 8 (HV), Pin 6 (VCC) and Pin 5 (Drv)
-
Maximum Current for all pins except VCC (6), HV (8) and Demag (1) when 10 V ESD diodes are
-
activated
-0.3 to 10
V
5.0
mA
Maximum Current in Pin 1
Idem
+3.0/-2.0
mA
Thermal Resistance, Junction-to-Case
RqJC
57
°C/W
Thermal Resistance, Junction-to-Air, SOIC version
Thermal Resistance, Junction-to-Air, DIP8 version
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Operating Junction Temperature
RqJA
RqJA
TJ
178
100
-40 to +125
°C/W
°C/W
°C
Maximum Junction Temperature
TJMAX
150
°C
Temperature Shutdown
-
155
°C
Hysteresis in Shutdown
-
30
°C
Storage Temperature Range
-
-60 to +150
°C
ESD Capability, HBM Model (All pins except HV)
-
2.0
kV
ESD Capability, Machine Model
-
200
V
Maximum Voltage on Pin 8 (HV), Pin 6 (VCC) decoupled to ground with 10 mF
VHVMAX
500
V
Minimum Voltage on Pin 8 (HV), Pin 6 (VCC) decoupled to ground with 10 mF
VHVMIN
40
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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