MSM6588L Просмотр технического описания (PDF) - Oki Electric Industry

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Компоненты Описание

производитель

MSM6588L

ADPCM Solid-State Recorder (for Serial Registers)

Oki Electric Industry 

¡ Semiconductor

TQFP44-P-1010-0.80-K

MSM6588/6588L

(Unit : mm)

Mirror finish

Notes for Mounting the Surface Mount Type Package

Package material

Lead frame material

Pin treatment

Solder plate thickness

Package weight (g)

Epoxy resin

42 alloy

Solder plating

5 mm or more

0.28 TYP.

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which

are very susceptible to heat in reflow mounting and humidity absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the

product name, package name, pin number, package code and desired mounting conditions

(reflow method, temperature and times).

101/101

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