MMSZ5246ET3G(2012) Просмотр технического описания (PDF) - ON Semiconductor

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MMSZ5246ET3G
(Rev.:2012)

Zener Voltage Regulators

ON Semiconductor 

MMSZ52xxET1G Series,

SZMMSZ52xxET1G Series

Zener Voltage Regulators

500 mW SOD−123 Surface Mount

Three complete series of Zener diodes are offered in the convenient,

surface mount plastic SOD−123 package. These devices provide a

convenient alternative to the leadless 34−package style.

Features

 500 mW Rating on FR−4 or FR−5 Board

 Wide Zener Reverse Voltage Range − 2.4 V to 110 V

 Package Designed for Optimal Automated Board Assembly

 Small Package Size for High Density Applications

 General Purpose, Medium Current

 ESD Rating of Class 3 (> 16 kV) per Human Body Model

 Peak Power − 225 W (8 x 20 ms)

 SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

 Pb−Free Packages are Available*

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic case

FINISH: Corrosion resistant finish, easily solderable

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260C for 10 Seconds

POLARITY: Cathode indicated by polarity band

FLAMMABILITY RATING: UL 94 V−0

MAXIMUM RATINGS

Rating

Symbol Max Units

Peak Power Dissipation @ 20 ms (Note 1)

@ TL  25C

Total Power Dissipation on FR−5 Board,

(Note 3) @ TL = 75C

Derated above 75C

Ppk

225

W

PD

500

mW

6.7 mW/C

Thermal Resistance, (Note 2)

Junction−to−Ambient

RqJA

C/W

340

Thermal Resistance, (Note 2)

Junction−to−Lead

RqJL

C/W

150

Junction and Storage Temperature Range

TJ, Tstg −55 to

C

+150

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Nonrepetitive current pulse per Figure 11.

2. Thermal Resistance measurement obtained via infrared Scan Method.

3. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

http://onsemi.com

SOD−123

CASE 425

STYLE 1

1

Cathode

2

Anode

MARKING DIAGRAM

1

xxx M G

G

xxx = Device Code (Refer to page 2)

M = Date Code

G = Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

Device

Package

Shipping†

MMSZ52xxET1G

SOD−123

(Pb−Free)

3,000 /

Tape & Reel

SZMMSZ52xxET1G SOD−123

(Pb−Free)

3,000 /

Tape & Reel

MMSZ52xxET3G

SOD−123

(Pb−Free)

10,000 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 2 of

this data sheet.

 Semiconductor Components Industries, LLC, 2012

1

February, 2012 − Rev. 8

Publication Order Number:

MMSZ5221ET1/D

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