76113SK8 Просмотр технического описания (PDF) - Fairchild Semiconductor
Номер в каталоге
Компоненты Описание
производитель
76113SK8 Datasheet PDF : 12 Pages
| |||
HUF76113SK8
positioned FR-4 board with 1oz copper after 1000 seconds
of steady state power with no air flow. This graph provides
the necessary information for calculation of the steady state
junction temperature or power dissipation. Pulse applications
can be evaluated using the Fairchild device Spice thermal
model or manually utilizing the normalized maximum
transient thermal impedance curve.
250
RθJA = 79.3 - 21.8*ln(AREA)
200
177 oC/W - 0.0115in2
143 oC/W - 0.054in2
150
100
50
0.001
0.01
0.1
1.0
AREA, TOP COPPER AREA (in2)
FIGURE 23. THERMAL RESISTANCE vs MOUNTING PAD AREA
Displayed on the curve are the three RθJA values listed in
the Electrical Specifications table. The three points where
chosen to depict the compromise between the copper board
area, the thermal resistance and ultimately the power
dissipation, PD(MAX). Thermal resistances corresponding to
other component side copper areas can be obtained from
Figure 23 or by calculation using Equation 2. The area, in
square inches is the top copper area including the gate and
source pads.
Rθ JA = 79.3 – 21.8 × ln (Area)
(EQ. 2)
©2003 Fairchild Semiconductor Corporation
HUF76113SK8 Rev. B1
Share Link: 