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MCP73844-820I Просмотр технического описания (PDF) - Microchip Technology

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MCP73844-820I Datasheet PDF : 24 Pages
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MCP73841/2/3/4
10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
E
E1
p
B
n
D
2
1
c
(F)
β
φ
A
A1
L
L1
α
A2
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
INCHES
MIN
NOM
10
.020 TYP
-
-
.030
.033
.000
-
.193 BSC
.118 BSC
.118 BSC
MAX
.043
.037
.006
MILLIMETERS*
MIN
NOM
10
0.50 TYP.
-
-
0.75
0.85
0.00
-
4.90 BSC
3.00 BSC
3.00 BSC
Foot Length
Footprint
Foot Angle
Lead Thickness
L
.016
.024
.031
0.40
0.60
F
.037 REF
0.95 REF
φ
-
-
c
.003
-
.009
0.08
-
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
B
.006
.009
.012
0.15
0.23
α
-
15°
-
β
-
15°
-
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-187
Drawing No. C04-021
MAX
1.10
0.95
0.15
0.80
0.23
0.30
15°
15°
DS21823B-page 20
2004 Microchip Technology Inc.

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