MCP7381X LI-ION BATTERY CHARGER
EVALUATION BOARD USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 1
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 1
Conventions Used in this Guide ............................................................................ 2
Recommended Reading........................................................................................ 2
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 3
Document Revision History ................................................................................... 3
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 5
1.2 What is the MCP7381X Li-Ion Battery Charger Evaluation Board? ............... 7
1.3 What the MCP7381X Li-Ion Battery Charger Evaluation Board Kit Includes . 7
Chapter 2. Installation and Operation
2.1 Introduction ..................................................................................................... 9
2.2 Features ......................................................................................................... 9
2.3 Getting Started ............................................................................................. 10
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 13
A.2 Board – Schematic ....................................................................................... 14
A.3 Board – Top Layer ....................................................................................... 15
A.4 Board – Top Metal Layer ............................................................................. 15
A.5 Board – Bottom Layer ................................................................................. 16
Appendix B. Bill Of Materials (BOM)
Worldwide Sales and Service .................................................................................... 18
© 2008 Microchip Technology Inc.
DS51729A-page iii