MCF5275L Просмотр технического описания (PDF) - Freescale Semiconductor

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MCF5275L

Integrated Microprocessor Family Hardware Specification

Freescale Semiconductor 

6.2 Package Dimensions - 256 MAPBGA

Figure 6 shows MCF5275 256 MAPBGA package dimensions.

Mechanicals/Pinouts

X

D

Y

LASER MARK FOR PIN A1

M

IDENTIFICATION IN

THIS AREA

K

E

A A2

A1

S

15X e

0.20

16151413121110

M

15X e

S

7654321

METALIZED MARK FOR

PIN A1 IDENTIFICATION

IN THIS AREA

A

B

C

D

E

F

G

256X b 3

H

J

K

0.25 M Z X Y

L

M

0.10 M Z

N

P

R

T

VIEW M-M

5

0.30 Z

Z4

256X

0.15 Z

DETAIL K

ROTATED 90 °CLOCKWISE

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSION b IS MEASURED AT THE

MAXIMUM SOLDER BALL DIAMETER,

PARALLEL TO DATUM PLANE Z.

4. DATUM Z (SEATING PLANE) IS DEFINED BY

THE SPHERICAL CROWNS OF THE SOLDER

BALLS.

5. PARALLELISM MEASUREMENT SHALL

EXCLUDE ANY EFFECT OF MARK ON TOP

SURFACE OF PACKAGE.

MILLIMETERS

DIM MIN MAX

A 1.25 1.60

A1 0.27 0.47

A2 1.16 REF

b 0.40 0.60

D 17.00 BSC

E 17.00 BSC

e 1.00 BSC

S 0.50 BSC

Figure 4. 256 MAPBGA Package Dimensions

MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 2

Freescale Semiconductor

Preliminary—Subject to Change Without Notice

15

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