MC33886DH Просмотр технического описания (PDF) - Motorola => Freescale

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производитель

MC33886DH

5.0 A H BRIDGE

Motorola => Freescale 

Freescale Semiconductor, Inc.

PACKAGE INFORMATION

The 33886 is designed for enhanced thermal performance.

The significant feature of this device is the exposed copper pad

on which the power die is soldered. This pad is soldered on a

PCB to provide heat flow to ambient and also to provide thermal

capacitance. The more copper area on the PCB, the better the

power dissipation and transient behavior will be.

Figure 20 shows the thermal response with the device

soldered on to the test PCB described in Figure 19.

100

Example Characterization on a double-sided PCB: bottom

side area of copper is 7.8 cm2; top surface is 2.7 cm2 (see

10

Figure 19); grid array of 24 vias 0.3 mm in diameter.

Rth (°C/W)

1

Top Side

Bottom Side

Figure 19. PCB Test Layout

0,1

0,001

0,01

0,1

1

10

t, Time (s)

100

1000

10000

Figure 20. 33886 Thermal Response

MOTOROLA ANALOG INTEGRATED CIRFCoUrITMDEoVrIeCEIDnAfoTArmation On This Product,

Go to: www.freescale.com

33886

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