M24C64-WBN3TPA Просмотр технического описания (PDF) - STMicroelectronics

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Компоненты Описание

производитель

M24C64-WBN3TPA

128 Kbit, 64 Kbit and 32 Kbit serial I²C bus EEPROM

STMicroelectronics 

M24128, M24C64, M24C32

Package mechanical data

Figure 16. TSSOP8 – 8 lead thin shrink small outline, package outline

D

8

5

c

E1 E

1

4

α

A

CP

A2

b

e

A1

L

L1

TSSOP8AM

1. Drawing is not to scale.

Table 21.

Symbol

TSSOP8 – 8 lead thin shrink small outline, package mechanical data

millimeters

inches(1)

Typ.

Min.

Max.

Typ.

Min.

Max.

A

1.200

A1

0.050

0.150

A2

1.000

0.800

1.050

0.0394

b

0.190

0.300

c

0.090

0.200

CP

0.100

D

3.000

2.900

3.100

0.1181

e

0.650

–

–

0.0256

E

6.400

6.200

6.600

0.2520

E1

4.400

4.300

4.500

0.1732

L

0.600

0.450

0.750

0.0236

L1

1.000

0.0394

α

0°

8°

1. Values in inches are converted from mm and rounded to 4 decimal digits.

0.0020

0.0315

0.0075

0.0035

0.1142

–

0.2441

0.1693

0.0177

0°

0.0472

0.0059

0.0413

0.0118

0.0079

0.0039

0.1220

–

0.2598

0.1772

0.0295

8°

31/39

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