6090FE Просмотр технического описания (PDF) - Linear Technology

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6090FE

140V CMOS Rail-to-Rail Output, Picoamp Input Current Op Amp

Linear Technology 

Applications Information

LTC6090

LTC6090 V+

TO LOW

VOLTAGE

CONTROL

2M

OD

10k

V+

TIE TO LOW

VOLTAGE GROUND

TO LOW

VOLTAGE

CONTROL

LOW VOLTAGE

SUPPLY

200k

2M

COM

10k

2M

V–

10k

TFLAG

10k

500Ω

30k

V–

6090 F01

Figure 1. Low Voltage Interface

V+

OUT

10V/DIV

1ms/DIV

6090 F02

Figure 2. Starting Up

OD

2V/DIV

OUT

2V/DIV

2.5ms/DIV

6090 F03

Figure 3. LTC6090 Output Disable Function

For simplest shutdown operation, float the COM pin, and

tie the OD pin to the TFLAG pin. This will float the low

voltage control pins, and the overtemperature circuit will

safely shutdown the output stage if the die temperature

reaches 145°C.

Since the OD pin is referenced to the COM pin, precaution

should be exercised and the absolute maximum ratings

should be observed for the COM and OD pins.

When coming out of shutdown the LTC6090 bias circuits

and input stage are already powered up leaving only the

output stage to turn on and drive to the proper output

voltage. Figures 2 and 3 show the part starting up and

coming out of shutdown, respectively.

Thermal Shutdown

The TFLAG pin is an open drain output pin that sinks 120µA

(typical) when the die temperature exceeds 145°C. The

temperature sensor has 5°C of hysteresis requiring the

part to cool to 140°C before disabling the TFLAG pin. Since

the TFLAG pin is referenced to the COM pin, precaution

should be exercised and the absolute maximum ratings

should be observed for the COM and TFLAG pins.

Tying the TFLAG pin to the OD pin will automatically shut

down the output stage when the die temperature exceeds

145°C as shown in Figure 4. This will ensure that the junc-

tion temperature does not exceed 150°C.

For safety, an independent second overtemperature

threshold shuts down the output stage if the internal die

temperature rises to 175°C. There is hysteresis in the

thermal shutdown circuit requiring the die temperature

to cool 7°C. Once the device has cooled sufficiently, the

output stage will enable. Degradation can occur or reli-

ability may be affected when the junction temperature

of the device exceeds 150°C.

6090fa

11

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