3575FE Просмотр технического описания (PDF) - Linear Technology

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Компоненты Описание

производитель

3575FE

Isolated Flyback Converter without an Opto-Coupler

Linear Technology 

PACKAGE DESCRIPTION

2.74

(.108)

FE Package

16-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663)

Exposed Pad Variation BA

4.90 – 5.10*

(.193 – .201)

2.74

(.108)

16 1514 13 12 1110 9

6.60 ±0.10

4.50 ±0.10

SEE NOTE 4

2.74

(.108)

0.45 ±0.05

1.05 ±0.10

0.65 BSC

RECOMMENDED SOLDER PAD LAYOUT

4.30 – 4.50*

(.169 – .177)

0.25

REF

0° – 8°

2.74

(.108)

6.40

(.252)

BSC

12345678

1.10

(.0433)

MAX

0.09 – 0.20

(.0035 – .0079)

0.50 – 0.75

(.020 – .030)

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2.

DIMENSIONS

ARE

IN

MILLIMETERS

(INCHES)

3. DRAWING NOT TO SCALE

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

TYP

0.05 – 0.15

(.002 – .006)

FE16 (BA) TSSOP 0204

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

LT3575

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation

that the interconnection of its circuits as described herein will not infringe on existing patent rights.

3575f

23

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