LT1469ACDF(RevA) Просмотр технического описания (PDF) - Linear Technology

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производитель

LT1469ACDF
(Rev.:RevA)

Dual 90MHz, 22V/µs 16-Bit Accurate Operational Amplifi er

Linear Technology 

PACKAGE DESCRIPTION

DF Package

12-Lead Plastic DFN (4mm × 4mm)

(Reference LTC DWG # 05-08-1773 Rev Ø)

2.50 REF

0.70 ±0.05

4.50 ± 0.05

3.10 ± 0.05

3.38 ±0.05

2.65 ± 0.05

LT1469

PACKAGE OUTLINE

0.25 ±0.05

0.50 BSC

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

4.00 ± 0.10

(4 SIDES)

7

2.50 REF

12

0.40 ± 0.10

3.38 ±0.10

2.65 ± 0.10

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.75 ± 0.05

6

R = 0.115

TYP

PIN 1 NOTCH

R = 0.20 TYP OR

0.35 × 45°

CHAMFER

(DF12) DFN 0806 REV Ø

1

0.25 ± 0.05

0.50 BSC

BOTTOM VIEW—EXPOSED PAD

0.00 – 0.05

NOTE:

1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220

VARIATION (WGGD-X)—TO BE APPROVED

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

1469fa

17

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