LT1129IS8-5TRPBF Просмотр технического описания (PDF) - Linear Technology
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LT1129IS8-5TRPBF Datasheet PDF : 16 Pages
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LT1129/LT1129-3.3/LT1129-5
APPLICATIONS INFORMATION
Table 4. Fault Conditions
INPUT PIN
SHDN PIN
< VOUT (Nominal)
Open (Hi)
OUTPUT PIN
Forced to VOUT (Nominal)
< VOUT (Nominal)
Grounded
Forced to VOUT (Nominal)
Open
Open
Open (Hi)
Grounded
Forced to VOUT (Nominal)
Forced to VOUT (Nominal)
Reverse Output Current ≈ 15μA (See Figure 3)
Input Current ≈ 1μA (See Figure 4)
Reverse Output Current ≈ 15μA (See Figure 3)
Input Current ≈ 1μA (See Figure 4)
Reverse Output Current ≈ 15μA (See Figure 3)
Reverse Output Current ≈ 15μA (See Figure 3)
PACKAGE DESCRIPTION
F Package
20-Lead Plastic TSSOP (4.4mm)
(LTC DWG # 05-08-1650)
1.05 ±0.10
6.40 – 6.60*
(.252 – .260)
20 19 18 17 16 15 14 13 12 11
6.60 ±0.10
4.50 ±0.10
6.40
(.252)
BSC
0.45 ±0.05
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50**
(.169 – .177)
0.25
REF
0° – 8°
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
1 2 3 4 5 6 7 8 9 10
1.10
(.0433)
MAX
0.65
(.0256)
BSC
0.19 – 0.30
(.0075 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
F20 TSSOP 0204
OBSOLETE PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
112935ff
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