LCDA15C-6T Просмотр технического описания (PDF) - Semtech Corporation
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LCDA15C-6T Datasheet PDF : 6 Pages
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LCDA15C-6
PROTECTION PRODUCTS
Applications Information
Device Connection Options for Protection of Six High-
Speed Data Lines
The LCDA15C-6 may be configured to protect up to six
I/O lines operating between 5 and 15V. It may be used
to protect the most popular serial data interface
standard lines making it ideal for use in equipment
utilizing multi-mode transceivers. Data lines are
connected at pins 1, 2, 3, 6, 7, and 8. Pins 4 and 5
are connected to ground. For best results, these pins
should be connected directly to a ground plane on the
board. The path length should be kept as short as
possible to minimize parasitic inductance.
Device Connection
Multi-Mode Transceiver Protection
A typical multi-mode transceiver protection circuit is
shown. The LCDA15C-6 is used to protect I/O lines
with external connections. The LCDA15C-6 adds a
maximum loading capacitance of 15pF with a working
voltage of 15V. This allows the transceiver to safely
operate in all modes without clipping or degradation of
the signal.
With proper design and layout, the transceiver port can
be protected to >15kV (HBM per IEC 61000-4-2).
Multi-Mode Tranceiver Protection Example
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended:
z Place the LCDA15C-6 near the input terminals or
connectors to restrict transient coupling.
z Minimize the path length between the LCDA15C-6
and the protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
2005 Semtech Corp.
4
www.semtech.com
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