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LA4425PV Просмотр технического описания (PDF) - SANYO -> Panasonic

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LA4425PV Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
LA4425PV
Pd max -- Ta
6.0
5.15
5.0
Board specifications of the Pdmax - Ta measurement
(LA4425PV specified PCB)
4.0
Size: 70mm × 70mm × 1.6mm3 (Four layer boards)
Copper foil thickness: L1/L4=18µm, L2/L3=35µm
3.0
Materials: FR-4 (Glass cloth matrix epoxy resin)
2.68
2.0
1.0
0
-40
-20
0
20
40
60
80
100
Ambient temperature, Ta -- C
L1: Figure of copper wiring pattern
L2: Figure of copper wiring pattern
L3: Figure of copper wiring pattern
L4: Figure of copper wiring pattern
Notes:
The data for the case with the exposed die-pad substrate mounted shows the values when 95% or more of the Exposed
Die-Pad is wet.
1. For the set design, employ the derating design with sufficient margin.
2. Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such
as vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below:
(1) Maximum value 80% or less for the voltage ratings
(2) Maximum value 80% or less for the current ratings
(3) Maximum value 80% or less for the temperature ratings
3. After the set has been designed, be sure to verify the design with the actual product. Confirm the solder joint state
and verify also the reliability of solder joint for the Exposed Die-Pad, etc. Any void or deterioration, if observed in
the solder joint of these parts, causes deteriorated thermal conduction, possibly resulting in thermal destruction of
IC.
No.A2011-3/8

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