L6668 Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге

Компоненты Описание

производитель

L6668

SMART PRIMARY CONTROLLER

STMicroelectronics 

L6668

5 Package information

In order to meet environmental requirements, STMicroelectronics offers this device in ECOPACK® pack-

age. This package has a Lead-free second level interconnect. The category of second level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK

is an STMicroelectronics trademark.

ECOPACK specifications are available at: www.st.com.

Figure 47. SO16 (Narrow) Mechanical Data & Package Dimensions

mm

inch

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A

1.75

0.069

a1 0.1

0.25 0.004

0.009

a2

1.6

0.063

b 0.35

0.46 0.014

0.018

b1 0.19

0.25 0.007

0.010

C

0.5

0.020

c1

45° (typ.)

D(1) 9.8

10 0.386

0.394

E

5.8

6.2 0.228

0.244

e

1.27

0.050

e3

8.89

0.350

F(1) 3.8

4.0 0.150

0.157

G 4.60

5.30 0.181

0.208

L

0.4

1.27 0.150

0.050

M

0.62

0.024

S

8 ° (max.)

(1) "D" and "F" do not include mold flash or protrusions - Mold

flash or protrusions shall not exceed 0.15mm (.006inc.)

OUTLINE AND

MECHANICAL DATA

SO16 (Narrow)

0016020 D

21/23

Share Link: