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L4979D Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
производитель
L4979D
ST-Microelectronics
STMicroelectronics ST-Microelectronics
L4979D Datasheet PDF : 22 Pages
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Package and PCB thermal data
Table 11.
SO-8 thermal parameter
Area (cm2)
R1 (°C/W)
R2 (°C/W)
R3 (°C/W)
R4 (°C/W)
R5 (°C/W)
R6 (°C/W)
C1 (W.s/°C)
C2 (W.s/°C)
C3 (W.s/°C)
C4 (W.s/°C)
C5 (W.s/°C)
C6 (W.s/°C)
4.2
SO-20 thermal data
Figure 9. SO-20 PC board
Footprint
4
2
2
41
40
58
0.0003
0.0025
0.03
0.04
0.1
1.05
L4979D, L4979MD
2
40
2
*$3*&)7
1.
Layout condition of Rth and Zth measurements (PCB: FR4
Cu thickness = 35 mm, Copper areas: from minimum pad
area = 58
lay-out to
mm x 58
6cm2).
mm,
PCB
thickness
=
2
mm,
14/22
Doc ID 10262 Rev 9

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