PK20N64VMF120 Просмотр технического описания (PDF) - Freescale Semiconductor

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PK20N64VMF120

Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

Freescale Semiconductor 

5.3.1

Peripheral operating requirements and behaviors

Thermal operating requirements

Table 9. Thermal operating requirements

Symbol

TJ

TA

Description

Die junction temperature

Ambient temperature

Min.

Max.

Unit

–40

125

°C

–40

105

°C

5.3.2 Thermal attributes

Board Symbol

type

Single-layer RθJA

(1s)

Four-layer RθJA

(2s2p)

Single-layer RθJMA

(1s)

Four-layer RθJMA

(2s2p)

—

RθJB

—

RθJC

—

ΨJT

Description

Thermal resistance, junction to ambient (natural

convection)

Thermal resistance, junction to ambient (natural

convection)

Thermal resistance, junction to ambient (200 ft./min.

air speed)

Thermal resistance, junction to ambient (200 ft./min.

air speed)

Thermal resistance, junction to board

Thermal resistance, junction to case

Thermal characterization parameter, junction to

package top outside center (natural convection)

100 LQFP Unit

TBD

°C/W

TBD

°C/W

TBD

°C/W

TBD

°C/W

TBD

TBD

TBD

°C/W

°C/W

°C/W

Notes

1

1

1

1

2

3

4

1.

Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental

Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method

Environmental Conditions—Forced Convection (Moving Air).

6 Peripheral operating requirements and behaviors

All digital I/O switching characteristics assume:

1. output pins

• have CL=30pF loads,

• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and

• are configured for high drive strength (PORTx_PCRn[DSE]=1)

2. input pins

• have their passive filter disabled (PORTx_PCRn[PFE]=0)

6.1 Core modules

K20 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.

Freescale Semiconductor, Inc.

Preliminary

19

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