IS25C04 Просмотр технического описания (PDF) - Integrated Silicon Solution

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IS25C04

2K-BIT/4K-BIT SPI SERIAL ELECTRICALLY ERASABLE PROM

Integrated Silicon Solution 

PACKAGING INFORMATION

150-mil Plastic SOP

Package Code: G, GR

N

EH

1

D

A

SEATING PLANE

A1

L

e

B

ISSI®

α

C

150-mil Plastic SOP (G, GR)

Symbol Min Max

Min Max

Ref. Std.

Inches

mm

No. Leads

8

A

— 0.068

8

— 1.73

A1 0.004 0.009

0.1 0.23

B 0.013 0.020

C 0.007 0.010

0.33 0.51

0.18 0.25

D 0.189 0.197

4.8

5

E 0.150 0.157

H 0.228 0.245

3.81 3.99

5.79 6.22

e

0.050 BSC

1.27 BSC

L 0.020 0.035

0.51 0.89

Notes:

1. Controlling dimension: inches, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash protrusions and should be

measured from the bottom of the package.

4. Formed leads shall be planar with respect to one another within 0.004 inches at the

seating plane.

Integrated Silicon Solution, Inc. — 1-800-379-4774

2

Rev. C

10/03/01

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