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ILX553B Просмотр технического описания (PDF) - Sony Semiconductor

Номер в каталоге
Компоненты Описание
производитель
ILX553B
Sony
Sony Semiconductor Sony
ILX553B Datasheet PDF : 12 Pages
First Prev 11 12
Package Outline
Unit: mm
10.6 ± 0.3
22 pin DIP (400mil)
55.7 ± 0.3
36.05 (7µm X 5150pixels)
22
12
V
H
No.1 Pixel
1
11
53.00
( 4.55 )
2.54
0.51
0.3 M
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
Plastic, Ceramic
GOLD PLATING
42 ALLOY
5.43g
LS-B23-02(E)
1. The height from the bottom to the sensor surface is 2.38 ± 0.3mm.
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.

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