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ILX551B Просмотр технического описания (PDF) - Sony Semiconductor

Номер в каталоге
Компоненты Описание
производитель
ILX551B
Sony
Sony Semiconductor Sony
ILX551B Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Package Outline
Unit: mm
22 pin DIP (400mil)
7.35 ± 0.5
22
41.6 ± 0.5
28.672 (14µm X 2048Pixels)
12
V
H
No.1 Pixel
1
11
1. The height from the bottom to the sensor surface is 2.45 ± 0.3mm.
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
2.54
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
Cer-DIP
TIN PLATING
42 ALLOY
5.20g
LS-A18-01(E)
0.51
0.3 M

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