HSMF-C655 Просмотр технического описания (PDF) - HP => Agilent Technologies

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Компоненты Описание

производитель

HSMF-C655

Bicolor Surface Mount Chip LEDs

HP => Agilent Technologies 

7

30°

40°

10°

20°

0°

1.0

.8

50°

.6

60°

.4

70°

80°

.2

90°

10° 20° 30° 40° 50° 60° 70° 80° 90°100°

ANGLE

Figure 5. Intensity vs. Angle.

10 SEC. MAX.

PRE-HEAT 140-160°C

230°C MAX.

4°C/SEC.

MAX.

OVER 2 MIN.

4°C/SEC. MAX.

TIME

Figure 6. Recommended Reflow Soldering Profile.

USER FEED DIRECTION

1.0 (0.039)

1.5

(0.059)

2.0

(0.079)

1.5

(0.059)

1.0 (0.039)

0.4

(0.016)

Figure 7. Recommended Solder Pattern.

PRINTED LABEL

Figure 8. Reeling Orientation.

CATHODE SIDE

2.0

(0.08)

21.0

(0.83)

LABEL

60°

60°

NOTE:

ALL DIMENSIONS IN MILLIMETERS (INCHES).

Figure 9. Reel Dimensions.

Ø(71.8008)

Ø(620.3.06)

Ø(01.35.10)

11.4

(0.45)

9.0

(0.35)

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