HLMP-P202S Просмотр технического описания (PDF) - Avago Technologies
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HLMP-P202S
Avago Technologies
HLMP-P202S Datasheet PDF : 11 Pages
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(L) Recommended Reflow Soldering Profile and Soldering Pad Pattern for SMT Options
3°C/SEC. MAX.
125-170°C
2-3°C/SEC.
120 SEC. MAX.
60-150
SEC.
TIME
10 SEC. MAX.
+5
230 –0 °C MAX.
183°C
3-4°C/SEC.
50°C
25°C
Recommended SnPb reflow soldering profile.
Wait until device has cooled to room temperature before handling.
217 °C
200 °C
150 °C
255 - 260 °C
3 °C/SEC. MAX.
3 °C/SEC. MAX.
60 - 120 SEC.
10 - 30 SEC.
6 °C/SEC. MAX.
100 SEC. MAX.
TIME
(Acc. to J-STD-020C)
Recommended Pb-free reflow soldering profile.
1.78
(0.070)
3.58 (0.140)
0.89
(0.035)
0.45
(0.018)
0.89 (0.035)
0.45 (0.018)
Recommended soldering pad pattern for gull wing leads 11, 12, and 14.
#27 DRILL
3.73 (0.147) DIA.
CLEARANCE HOLE
THROUGH PC BOARD
3.30 (0.130)
6.60 (0.260)
1.27
(0.50)
0.45
(0.018)
0.89
(0.035)
#27 DRILL
3.73 (0.147) DIA.
CLEARANCE HOLE
THROUGH PC BOARD
1.27
(0.50)
0.89
(0.035)
DIMENSIONS ARE IN
MILLIMETERS (INCHES)
0.64 (0.025)
0.45
(0.018)
DIMENSIONS ARE IN
MILLIMETERS (INCHES)
3.30 (0.130)
6.60 (0.260)
Recommended soldering pad pattern for yoke leads 21, 22, and 24.
Recommended soldering pad pattern for Z-bend leads 31, 32, and 34.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-1206EN
AV02-0069EN - September 2, 2008
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