INA-12063-BLK Просмотр технического описания (PDF) - HP => Agilent Technologies

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INA-12063-BLK

1.5 GHz Low Noise Self-Biased Transistor Amplifier

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• A Note on Supply Line

Bypassing

When multiple bypass capacitors

are used throughout the power

supply lines in a wireless system,

consideration should be given to

potential resonances. It is impor-

tant to ensure that the capacitors,

when combined with additional

parasitic L’s and C’s on the circuit

board, do not form resonant

circuits. The addition of a small

value resistor in the bias supply

line between bypass capacitors

will often “de-Q” the bias circuit

and eliminate resonance effects.

SMT Assembly

Reliable assembly of surface

mount components is a complex

process that involves many

material, process, and equipment

factors, including: method of

heating (e.g., IR or vapor phase

reflow, wave soldering, etc.)

circuit board material, conductor

thickness and pattern, type of

solder alloy, and the thermal

conductivity and thermal mass of

components. Components with a

low mass, such as the SOT-363

package, will reach solder reflow

temperatures faster than those

with a greater mass.

250

200

The INA-12063 is has been

qualified to the time-temperature

profile shown in Figure 29. This

profile is representative of an IR

reflow type of surface mount

assembly process.

After ramping up from room

temperature, the circuit board

with components attached to it

(held in place with solder paste)

passes through one or more

preheat zones. The preheat zones

increase the temperature of the

board and components to prevent

thermal shock and begin evapo-

rating solvents from the solder

paste. The reflow zone briefly

elevates the temperature suffi-

ciently to produce a reflow of the

solder.

The rates of change of tempera-

ture for the ramp-up and cool-

down zones are chosen to be low

enough to not cause deformation

of the board or damage to compo-

nents due to thermal shock. The

maximum temperature in the

reflow zone (TMAX) should not

exceed 235°C.

These parameters are typical for

a surface mount assembly

process for the INA-12063. As a

general guideline, the circuit

TMAX

150

Reflow

Zone

100

Preheat

Zone

Cool Down

Zone

50

0

0

60

120

180

TIME (seconds)

Figure 29. Surface Mount Assembly Profile.

240

300

board and components should be

exposed only to the minimum

temperatures and times neces-

sary to achieve a uniform reflow

of solder.

Statistical Parameters

Several categories of parameters

appear within this data sheet.

Parameters may be described

with values that are either

minimum or maximum, “typical,”

or standard deviations.

The values for parameters are

based on comprehensive product

characterization data, in which

automated measurements are

made on of a minimum of 500

parts taken from 3 non-consecu-

tive process lots of semiconduc-

tor wafers. The data derived from

product characterization tends to

be normally distributed, e.g., fits

the standard bell curve.

Parameters considered to be the

most important to system perfor-

mance are bounded by minimum

or maximum values. For the

INA-12063, these parameters are:

Power Gain (|S21|2), Noise Figure

(NF), and Device Current. Each

of these guaranteed parameters is

100% tested.

Values for most of the parameters

in the table of Electrical Specifi-

cations that are described by

typical data are the mathematical

mean (µ), of the normal distribu-

tion taken from the characteriza-

tion data. For parameters where

measurements or mathematical

averaging may not be practical,

such as S-parameters or Noise

Parameters and the performance

curves, the data represents a

nominal part taken from the

center of the characterization

distribution. Typical values are

intended to be used as a basis for

electrical design.

6-134

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