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Компоненты Описание
HCTS373D Просмотр технического описания (PDF) - Intersil
Номер в каталоге
Компоненты Описание
производитель
HCTS373D
Radiation Hardened Octal Transparent Latch, Three-State
Intersil
HCTS373D Datasheet PDF : 11 Pages
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HCTS373MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 x 4 mils
Metallization Mask Layout
D0
Q0
(3)
(2)
HCTS373MS
OE
VCC
Q7
(1)
(20)
(19)
D1 (4)
Q1 (5)
Q2 (6)
(18) D7
(17) D6
(16) Q6
(15) Q5
D2 (7)
(14) D5
(8)
(9)
D3
Q3
(10)
(11)
GND
LE
(12)
(13)
Q4
D4
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS373 is TA14403A.
Spec Number
518636
647
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