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Компоненты Описание
HCTS10HMSR Просмотр технического описания (PDF) - Intersil
Номер в каталоге
Компоненты Описание
производитель
HCTS10HMSR
Radiation Hardened Triple 3-Input NAND Gate
Intersil
HCTS10HMSR Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100nm
4 x 4 mils
Metallization Mask Layout
HCTS10MS
HCTS10MS
A1
VCC
C1
(1)
(14)
(13)
B1 (2)
A2 (3)
B2 (4)
C2 (5)
(6)
(7)
(8)
Y2
GND
Y3
8
(12) Y1
(11) C3
(10) B3
(9) A3
Spec Number
518778
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