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HAL11X Просмотр технического описания (PDF) - Micronas

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HAL11X Datasheet PDF : 17 Pages
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HAL115
4.2. HAL 115
The HAL 115 is a bipolar switching sensor (see Fig. 4–5).
The output turns low with the magnetic south pole on the
branded side of the package and turns high with the
magnetic north pole on the branded side. The output
state is not defined for all sensors if the magnetic field is
removed again. Some sensors will change the output
state and some sensors will not.
For correct functioning in the application, the sensor re-
quires both magnetic polarities (north and south) on the
branded side of the package.
Magnetic Features:
– switching type: bipolar
– high sensitivity
– typical BON: 1.2 mT at room temperature
– typical BOFF: –1.2 mT at room temperature
– operates with static magnetic fields and dynamic mag-
netic fields up to 20 kHz
Applications
The HAL 115 is the optimal sensor for all applications
with alternating magnetic signals at the sensor position
such as:
– rotating speed measurement,
– commutation of brushless DC-motors and cooling
fans.
Output Voltage
VO
BHYS
VOL
BOFF 0 BON
B
Fig. 4–5:Definition of magnetic switching points for the
HAL 115
Magnetic Characteristics at TJ = –40 °C to +140 °C, VDD = 4.5 V to 24 V,
Typical Characteristics for VDD = 12 V
Magnetic flux density values of switching points.
Positive flux density values refer to the magnetic south pole at the branded side of the package.
Parameter
TJ
–40 °C
25 °C
100 °C
140 °C
Min.
On point BON
Typ.
Max.
–10.7
1.4
12.5
–10.7
1.2
12.5
–10.7
1
12.5
–10.7
0.9
12.5
Min.
Off point BOFF
Typ.
Max.
–12.5
–1.4
10.7
–12.5
–1.2
10.7
–12.5
–1
10.7
–12.5
–0.9
10.7
Hysteresis BHYS
Unit
Min.
Typ.
Max.
1.8
2.8
7
mT
1.8
2.4
7
mT
1.5
2
7
mT
1
1.8
7
mT
The hysteresis is the difference between the switching points BHYS = BON – BOFF
The magnetic limits given above refer to parts in the original packaging. Mechanical stress on the hall sensitive areas
on the chip surface may generate an additional magnetic offset, which can slightly change the magnetic switching
points. This behavior is a physical phenomenon and not a malfunction of the sensor. Mechanical stress on the hall plates
can be caused, for example, by overmoulding the plastic package or by wide range temperature changes like soldering
or operating the parts at extreme temperatures.
Please use a sensor of the HAL 5xx family if higher robustness against mechanical stress is required.
12
Micronas

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