H34063B Просмотр технического описания (PDF) - Hi-Sincerity Mocroelectronics
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H34063B Datasheet PDF : 7 Pages
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HI-SINCERITY
MICROELECTRONICS CORP.
DIP-8 Dimension
Spec. No. : IC200806
Issued Date : 2008.07.07
Revised Date :
Page No. : 7/7
87 65
A
1 2 34
B
J
F
C
EG
H
ID
α1 K
M
L
8-Lead DIP-8
Plastic Package
AVANTICS Package Code: P
SO-8 Dimension
Marking:
Pin Style: 1.SWC 2.SWE 3.TC 4.GND
5.FB 6.VCC 7.Ipk 8.DRC
Material:
• Lead solder plating: Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
DIM Min. Max.
A
6.29 6.40
B
9.22 9.32
C
-
*1.52
D
-
*1.27
E
-
*0.99
F
3.25 3.35
G
3.17 3.55
H
0.38 0.53
I
2.28 2.79
J
7.49 7.74
K
-
*3.00
L
8.56 8.81
M 0.229 0.381
α1
94o
97o
*: Typical, Unit: mm
A
G
I
8 76 5
B
CH
Pin1 Index
23 4
D
E
Part A
F
J
K
Part A L
M
N
O
8-Lead SO-8 Plastic
Surface Mounted Package
AVANTICS Package Code: S
Marking:
Pb Free Mark
Pb-Free: " . " (Note) H
S
Normal: None
34063B
Pin 1 Index
Date Code
Control Code
Pin Style: 1.SWC 2.SWE 3.TC 4.GND
5.FB 6.VCC 7.Ipk 8.DRC
Material:
• Lead solder plating: Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
4.85 5.10
B
3.85 3.95
C
5.80 6.20
D
1.22 1.32
E
0.37 0.47
F
3.74 3.88
G
1.45 1.65
H
4.80 5.10
I
0.05 0.20
J
0.30 0.70
K
0.19 0.25
L
0.37 0.52
M
0.23 0.28
N
0.08 0.13
O
0.00 0.15
*: Typical, Unit: mm
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 FH: 886-2-25632712, 25368454
H34063BP, H34063BS
HSMC Product Specification
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