GS84118B-100 Просмотр технического описания (PDF) - Giga Semiconductor
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производитель
GS84118B-100 Datasheet PDF : 30 Pages
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Package Dimesions - 119 Pin PBGA
Pin 1
A
Corner
P
B
N
Top View
GS84118T/B-166/150/130/100
G
SD
7654321
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
R
Bottom View
Package Dimesions - 119 Pin PBGA
Symbo
l
Description
Min Nom Ma
. .x
A
Width
13.8 14.0 14.2
B
Length
21.8 22.0 22.2
C
Package Height (including ball) -
2.40
D
Ball Size
0.60 0.75 0.90
E
Ball Height
0.50 0.60 0.70
F Package Height (excluding balls)
1.46 1.70
G
Width between Balls
1.27
K
Package Height above board 0.80 0.90 1.00
N
Cut-out Package Width
12.00
P
Foot Length
19.50
R Width of package between balls
7.62
S Length of package between balls
20.32
T
Variance of Ball Height
0.15
Unit: mm
Side View
BPR 1999.05.18
Rev: 1.05 7/2001
28/30
© 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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