FSL137MRIN Просмотр технического описания (PDF) - Fairchild Semiconductor
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FSL137MRIN Datasheet PDF : 15 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min. Max. Unit
VSTR
VDS
VCC
VFB
VIN
IDM
ID
EAS
PD
TJ
TSTG
ESD
VSTR Pin Voltage
Drain Pin Voltage
VCC Pin Voltage
Feedback Pin Voltage
VIN Pin Voltage
Drain Current Pulsed
Continuous Switching Drain Current(5)
Single-Pulsed Avalanche Energy(6)
Total Power Dissipation (TC=25C)(7)
Maximum Junction Temperature
Operating Junction Temperature(8)
Storage Temperature
Electrostatic
Human Body Model, JESD22-A114
Discharge Capability Charged Device Model, JESD22-C101
700
V
700
V
26
V
-0.3
10.0
V
-0.3
10.0
V
12
A
3
A
230
mJ
1.5
W
150
C
-40
+125
C
-55
+150
C
4.5
kV
2.0
Notes:
5. Repetitive peak switching current when the inductive load is assumed: limited by maximum duty (DMAX=0.73) and
junction temperature (see Figure 4).
6. L=45 mH, starting TJ=25C.
7. Infinite cooling condition (refer to the SEMI G30-88).
8. Although this parameter guarantees IC operation, it does not guarantee all electrical characteristics.
IDS
DMAX
fSW
Figure 4. Repetitive Peak Switching Current
Thermal Impedance
TA=25°C unless otherwise specified.
Symbol
Parameter
Value
Unit
θJA
Junction-to-Ambient Thermal Impedance(9)
ΨJL
Junction-to-Lead Thermal Impedance(10)
80
°C/W
11
°C/W
Notes:
9. JEDEC recommended environment, JESD51-2, and test board, JESD51-10, with minimum land pattern.
10. Measured on drain pin #7, close to the plastic interface under Rthja test condition.
© 2012 Fairchild Semiconductor Corporation
FSL137MRIN • Rev. 1.0.1
4
www.fairchildsemi.com
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