TC7135CBU Просмотр технического описания (PDF) - Microchip Technology
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TC7135CBU Datasheet PDF : 24 Pages
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28-Lead Plastic Leaded Chip Carrier (LI) – Square (PLCC)
TC7135
E
E1
#leads=n1
D1 D
n12
CH2 x 45 ° CH1 x 45 °
α
A3
A2
32°
A
c
β
E2
B1
B
A1
p
D2
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
Number of Pins
n
28
28
Pitch
p
.050
1.27
Pins per Side
n1
7
7
Overall Height
A
.165
.173
.180
4.19
4.39
Molded Package Thickness
A2
.145
.153
.160
3.68
3.87
Standoff §
A1
.020
.028
.035
0.51
0.71
Side 1 Chamfer Height
A3
.021
.026
.031
0.53
0.66
Corner Chamfer 1
CH1
.035
.045
.055
0.89
1.14
Corner Chamfer (others)
CH2
.000
.005
.010
0.00
0.13
Overall Width
E
.485
.490
.495
12.32
12.45
Overall Length
D
.485
.490
.495
12.32
12.45
Molded Package Width
E1
.450
.453
.456
11.43
11.51
Molded Package Length
D1
.450
.453
.456
11.43
11.51
Footprint Width
E2
.410
.420
.430
10.41
10.67
Footprint Length
D2
.410
.420
.430
10.41
10.67
Lead Thickness
c
.008
.011
.013
0.20
0.27
Upper Lead Width
B1
.026
.029
.032
0.66
0.74
Lower Lead Width
B
.013
.020
.021
0.33
0.51
Mold Draft Angle Top
α
0
5
10
0
5
Mold Draft Angle Bottom
β
0
5
10
0
5
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-026
MAX
4.57
4.06
0.89
0.79
1.40
0.25
12.57
12.57
11.58
11.58
10.92
10.92
0.33
0.81
0.53
10
10
2004 Microchip Technology Inc.
DS21460C-page 17
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