AS29LV800 Просмотр технического описания (PDF) - Alliance Semiconductor

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производитель

AS29LV800

3V 1M × 8/512K × 16 CMOS Flash EEPROM

Alliance Semiconductor 

March 2001

Thin small outline package (TSOP-I)

Package dimensions

c

L

A2 A A1

pin 1

pin 48

pin 24

pin 25

48-pin

α

®

b

e

D Hd

E

AS29LV800

48-pin

12×20

Min

Max

A

–

1.27

A1

0.05

0.15

A2

0.95

1.05

b

0.17

0.27

c

0.15 nominal

D

18.20

18.60

e

0.50 nominal

E

11.90

12.10

Hd

19.80

20.20

L

0.50

0.70

α

0°

5°

Small Outline Plastic (SO)

Package dimensions

JEDEC MO - 175 AA

44-pin SO

Min (mm) Max (mm)

A

–

3.1

A1

0.05

–

A2

2.5

2.9

b

0.25

0.45

c

0.09

0.25

d

28.0

28.4

e

12.4

12.8

E

1.27 (typical)

He

16.05 (typical)

l

0.73

1.3

44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23

SO

e He

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

d

A

A2

A1

b

E

c

0–10°

l

3/22/01; V.1.0

Alliance Semiconductor

P. 24 of 25

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